PCN Assembly/Origin | Qualification Assembly/Test Site 03/Mar/2014 Qualification Wire Bond 27/May/2014 |
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Product Training Modules | NexFET MOSFET Technology |
Design Resources | Create your power design now with TI’s WEBENCH® Designer |
Mounting Type | Surface Mount |
FET Feature | Logic Level Gate |
Package / Case | 8-TDFN Exposed Pad |
Supplier Device Package | 8-SON |
Gate Charge (Qg) @ Vgs | 29nC @ 4.5V |
FET Type | MOSFET N-Channel, Metal Oxide |
Series | NexFET™ |
Input Capacitance (Ciss) @ Vds | 4100pF @ 12.5V |
Power - Max | 3.1W |
Video File | NexFET Power Block PowerStack™ Packaging Technology Overview |
Vgs(th) (Max) @ Id | 1.9V @ 250µA |
Packaging | Cut Tape (CT) |
Rds On (Max) @ Id, Vgs | 1.6 mOhm @ 40A, 10V |
Drain to Source Voltage (Vdss) | 25V |
Current - Continuous Drain (Id) @ 25°C | 38A (Ta), 100A (Tc) |
PCN Design/Specification | Qualification Revision A 01/Jul/2014 |
Online Catalog | N-Channel Logic Level Gate FETs |
Family | FETs - Single |
RoHS | Lead free / RoHS Compliant |
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