Pitch - Post | 0.100" (2.54mm) |
---|---|
Contact Finish Thickness - Post | 200µin (5.08µm) |
Housing Material | Thermoplastic, Polyester |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Termination | Solder |
Standard Package | 16 |
Features | Open Frame |
Contact Finish - Mating | Gold |
Family | Sockets for ICs, Transistors |
Operating Temperature | -40°C ~ 105°C |
ECCN | EAR99 |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Post | Beryllium Copper |
Pitch - Mating | 0.100" (2.54mm) |
Material Flammability Rating | UL94 V-0 |
Catalog Drawings | Machine Pin Solder Tail |
Contact Finish - Post | Tin |
Packaging | Tube |
Contact Finish Thickness - Mating | 30µin (0.76µm) |
Contact Resistance | 4 mOhm |
Current Rating | 3A |