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| 产品描述：
CSD17308Q3 , N沟道 MOSFET 晶体管, 47 A, Vds=30 V, 8针 SON封装
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| 标准包装：2500 | ||
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- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Datasheets | CSD17308Q3 Power Management Guide |
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| Product Training Modules | NexFET MOSFET Technology |
| PCN Assembly/Origin | Qualification Assembly/Test Site 03/Mar/2014 Qualification Wire Bond 27/May/2014 Assembly/Test Site Revision C 09/Feb/2015 |
| Online Catalog | N-Channel Standard FETs |
| PCN Design/Specification | Qualification Revision A 01/Jul/2014 |
| Mfg Application Notes | Ringing Reduction Techniques for MOSFETS SLYT466 Application Note |
| Video File | NexFET Power Block PowerStack™ Packaging Technology Overview |
| Manufacturer Product Page | CSD17308Q3 Specifications |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer |
| ECCN | EAR99 |
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