| 68-PGM11033-10 | ||
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| 产品描述：
68 Position Molded Housing 2.54 mm Pitch Solder Tail Pin Grid Array
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| 标准包装：1 | ||
| 数据手册： -- |
- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Termination | Solder |
|---|---|
| Termination Post Length | 0.165" (4.19mm) |
| Standard Package | 1 |
| Packaging | Bulk |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Post | Brass |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Material Flammability Rating | UL94 V-0 |
| ECCN | EAR99 |
| Pitch - Post | 0.100" (2.54mm) |
| Type | PGA |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200碌in (5.08碌m) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10碌in (0.25碌m) |
| Series | PGM |
| Family | Sockets for ICs, Transistors |
| Operating Temperature | -55掳C ~ 105掳C |
| Current Rating | 3A |
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