- 规格参数
- 产品特性
- 技术文档
- 产品评论
| PCN Assembly/Origin | Qualification Revision B 16/Jun/2014 |
|---|---|
| EDA / CAD Models | Download from Accelerated Designs |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer |
| PCN Design/Specification | Qualification TSSOP Devices 27/Sep/2013 |
| Datasheets | LM2727, LM2737 |
| Online Catalog | Buck (Step-Down) IC |
| PCN Packaging | Pack Material Update 11/May/2015 Packing Material Revision A 19/May/2015 |
| ECCN | ECL99 |
登录之后就可发表评论
请输入下方图片中的验证码：