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DILB8P-223TLF

8 Position 2.54 mm Pitch Open Frame Through Hole DIP Socket

Manufacturer Amphenol
MPN DILB8P-223TLF
SPQ 18000
ECCN EAR99
Schedule B --
RoHS --
Datasheet --
SP1038
Dollar $0.09707
RMB ¥0.80623
Stock type SP1038
Stock num 4
Stepped
num price
1+ $0.09707

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Product parameter

-Termination Solder
-Termination Post Length 0.124" (3.15mm)
-Contact Finish - Post Tin
-Part Status Active
-Number of Positions or Pins (Grid) 8 (2 x 4)
-Category Connectors, Interconnects
-Housing Material Polyamide (PA), Nylon
-Contact Finish Thickness - Mating 100µin (2.54µm)
-Pitch - Mating 0.100" (2.54mm)
-Mounting Type Through Hole
-Operating Temperature -55°C ~ 105°C
-Packaging Tube
-ECCN EAR99
-Pitch - Post 0.100" (2.54mm)
-Type DIP, 0.3" (7.62mm) Row Spacing
-Features Open Frame
-Contact Finish Thickness - Post 100µin (2.54µm)
-Manufacturer Amphenol FCI
-Contact Finish - Mating Tin
-Contact Material - Post Copper Alloy
-Contact Material - Mating Copper Alloy
-Family Sockets for ICs, Transistors
-Contact Resistance 30 mOhm
-Material Flammability Rating UL94 V-0
-Current Rating 1A

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