US-2008

PROTO BOARD 8PIN THRU-HOLE SIP

Manufacturer Capital Advanced Technologies, Inc. MPN US-2008 SPQ 1 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Board Thickness	0.031" (0.79mm) 1/32"
-Material	FR4 Epoxy Glass
-Size / Dimension	0.598" L x 0.800" W (15.20mm x 20.30mm)
-Category	Prototyping Products
-Proto Board Type	Through Hole to SIP
-Series	2000, UNI-SIP™
-Package Accepted	Non Specific
-Hole Diameter	0.036" (0.90mm)
-Part Status	Active
-Manufacturer	Capital Advanced Technologies
-Number of Positions	8
-Family	Adapter, Breakout Boards