SMDSWLF.031 4OZ

SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.

Manufacturer Chip Quik, Inc. MPN SMDSWLF.031 4OZ SPQ 1 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Melting Point	422 ~ 428°F (217 ~ 220°C)
-Core Size	0.022
-Part Status	Active
-Manufacturer	Chip Quik Inc.
-Form	Spool, 113g (1/4 lb)
-Series	CHIPQUIK®
-Wire Gauge	20 AWG, 21 SWG
-Composition	Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
-Type	Wire Solder
-Diameter	0.031" (0.79mm)
-Category	Soldering, Desoldering, Rework Products
-Weight	0.25 lb (113.4g)
-Process	Lead Free
-Family	Solder
-Flux Type	No-Clean