SMDSW.031 2OZ

SOLDER WIRE NO-CLEAN 63/37 2OZ.

Manufacturer Chip Quik, Inc. MPN SMDSW.031 2OZ SPQ 1 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Melting Point	361°F (183°C)
-Core Size	0.022
-Part Status	Active
-Manufacturer	Chip Quik Inc.
-Process	Leaded
-Family	Solder
-Flux Type	No-Clean
-Type	Wire Solder
-Diameter	0.031" (0.79mm)
-Category	Soldering, Desoldering, Rework Products
-Form	Spool, 57g (2 oz)
-Series	CHIPQUIK®
-Wire Gauge	20 AWG, 21 AWG
-Composition	Sn63Pb37 (63/37)