| -Impedance ratio ___[-25℃/+20℃] |
1.5 |
| -ESR (max) |
26 mΩ at 100k Hz / 20 ℃ |
| -LeadForming/Taping |
Taping Embossed |
| -Impedance ratio ___[-55℃/+20℃] |
2 |
| -Leakage current (min) |
63 uA at 2 min |
| -REACH Compliance (209 subst.) |
Yes |
| -attrname |
Soldering |
| -ESR(max)[Ω] |
0.026 |
| -Rated Ripple(Freq.)[Hz] |
100k |
| -Temp Lower[℃] |
-55 |
| -Endurance[hr] |
10000 |
| -Q200 |
-- |
| -Endurance ___[Capacitance change] |
Within ±30% of initial value |
| -Endurance ___[tanδchange] |
200% or less of initial specified value |
| -tanδ (max) |
0.08 |
| -RoHS Compliance (10 subst.) |
Yes |
| -Endurance ___[Test time] |
10000 hr at 105 ℃ |
| -Rated Ripple (max) |
2500 mArms at 100k Hz / 105 ℃ |
| -attrvalue |
Reflow |
| -Rated Ripple(max)[mArms] |
2500 |
| -Impedance(max)[Ω] |
-- |
| -Temp Upper[℃] |
105 |
| -RoHS |
RoHS compliance |
| -tanδ （max.） |
0.08 |
