HS09

HEATSINK TO3

制造商 Apex Microtechnology 制造商零件编号 HS09 标准包装 1 ECCN -- Schedule B -- RoHS -- 规格说明书 --

询价

需求数量		目标价格
联系电话		姓名
公司		邮箱

产品参数

-Type	Board Level
-Package Cooled	TO-3
-Part Status	Active
-Category	Fans, Thermal Management
-Power Dissipation @ Temperature Rise	7W @ 80°C
-Length	1.630" (41.40mm)
-Thermal Resistance @ Forced Air Flow	14.0°C/W @ 200 LFM
-Height Off Base (Height of Fin)	0.750" (19.05mm)
-Thermal Resistance @ Natural	11.7°C/W
-Attachment Method	Bolt On
-Material	Aluminum
-Shape	Rhombus
-Manufacturer	Apex Microtechnology
-Material Finish	Black Anodized
-Series	Apex Precision Power®
-Family	Thermal - Heat Sinks
-Width	1.290" (32.77mm)