English 简体中文 日本語

DILB20P-223TLF

20 Position (2 x 10 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

Manufacturer Amphenol
MPN DILB20P-223TLF
SPQ 1
ECCN EAR99
Schedule B --
RoHS --
Datasheet --
SP1027
Dollar $0.6045
RMB ¥5.02076
Stock type SP1027
Stock num 53267
Stepped
num price
83+ $0.6045

Quote

Demand quantity Target price
Contact number name
company email

Product parameter

-Termination Post Length 0.124" (3.15mm)
-Termination Solder
-Contact Finish - Post Tin
-Part Status Active
-Number of Positions or Pins (Grid) 20 (2 x 10)
-Category Connectors, Interconnects
-Housing Material Polyamide (PA), Nylon
-Contact Finish Thickness - Mating 100µin (2.54µm)
-Pitch - Mating 0.100" (2.54mm)
-Mounting Type Through Hole
-Operating Temperature -55°C ~ 105°C
-Packaging Tube
-ECCN EAR99
-Pitch - Post 0.100" (2.54mm)
-Type DIP, 0.3" (7.62mm) Row Spacing
-Features Open Frame
-Contact Finish Thickness - Post 100µin (2.54µm)
-Manufacturer Amphenol FCI
-Contact Finish - Mating Tin
-Contact Material - Post Copper Alloy
-Contact Material - Mating Copper Alloy
-Family Sockets for ICs, Transistors
-Contact Resistance 30 mOhm
-Material Flammability Rating UL94 V-0
-Current Rating 1A

Copyright © 1997-2013 NetEase. All Rights Reserved.