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BDN13-3CB/A01

HEATSINK CPU W/ADHESIVE 1.31SQ

制造商 CTS Electronic Components
制造商零件编号 BDN13-3CB/A01
标准包装 250
ECCN --
Schedule B --
RoHS --
规格说明书 --

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产品参数

-Type Top Mount
-Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
-Part Status Active
-Category Fans, Thermal Management
-Material Finish Black Anodized
-Series BDN
-Family Thermal - Heat Sinks
-Width 1.310" (33.27mm)
-Attachment Method Thermal Tape, Adhesive (Included)
-Material Aluminum
-Shape Square, Pin Fins
-Manufacturer CTS Thermal Management Products
-Length 1.310" (33.27mm)
-Thermal Resistance @ Forced Air Flow 6.0°C/W @ 400 LFM
-Height Off Base (Height of Fin) 0.355" (9.02mm)
-Thermal Resistance @ Natural 16.1°C/W

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