APF19-19-06CB

HEATSINK LOW-PROFILE FORGED

Manufacturer CTS Electronic Components MPN APF19-19-06CB SPQ 300 ECCN -- Schedule B -- RoHS -- Datasheet APF19-19-06CB.pdf

Quote

Demand quantity		Target price
Contact number		name
company		email

Product parameter

-Thermal Resistance:	7.05 C/W
-Product:	Heat Sinks
-Heatsink Material:	Aluminum
-Packaging:	Tray
-Manufacturer:	CTS
-Brand:	CTS Electronic Components
-Designed for:	BGA, PGA, PLCC, QFP
-Height:	6.3 mm
-Color:	Black
-Fin Style:	Vertical Fin
-Width:	19 mm
-Length:	19 mm
-Series:	APF
-RoHS:	Details
-Product Category:	Heat Sinks
-Mounting Style:	SMD/SMT