| -Termination |
Solder |
| -Type |
DIP, 0.3" (7.62mm) Row Spacing |
| -Contact Finish - Post |
Gold |
| -Packaging |
Bulk |
| -Contact Finish Thickness - Post |
Flash |
| -Housing Material |
Polybutylene Terephthalate (PBT), Glass Filled |
| -Contact Material - Post |
Beryllium Copper |
| -Contact Material - Mating |
Beryllium Copper |
| -Pitch - Mating |
0.100" (2.54mm) |
| -Mounting Type |
Through Hole |
| -Operating Temperature |
-55掳C ~ 125掳C |
| -Current Rating |
1A |
| -Pitch - Post |
0.100" (2.54mm) |
| -Standard Package |
60 |
| -Features |
Open Frame |
| -Other Related Documents |
How to Read Date Codes |
| -Number of Positions or Pins (Grid) |
8 (2 x 4) |
| -Contact Finish - Mating |
Gold |
| -Contact Finish Thickness - Mating |
Flash |
| -Series |
XR2 |
| -Family |
Sockets for ICs, Transistors |
| -Contact Resistance |
20 mOhm |
| -Material Flammability Rating |
UL94 V-0 |
