| -Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
| -Package / Case |
676-BBGA, FCBGA |
| -Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| -Peripherals |
DMA |
| -Number of I/O |
130 |
| -Connectivity |
CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| -Product Training Modules |
Powering Series 7 Xilinx FPGAs with TI Power Management Solutions |
| -Speed |
800MHz |
| -Family |
Embedded - System On Chip (SoC) |
| -MCU RAM |
256KB |
| -PCN Assembly/Origin |
Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 |
| -Supplier Device Package |
676-FCBGA (27x27) |
| -Architecture |
MCU, FPGA |
| -Standard Package |
1 |
| -PCN Design/Specification |
Zynq-7000 Datasheet Update 02/Jun/2014 |
| -Packaging |
Tray |
| -Series |
Zynq®-7000 |
| -Operating Temperature |
0°C ~ 100°C |
