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OS-S031

SOLDER NO-CLEAN .031" X 20'

Manufacturer EasyBraid Co.
MPN OS-S031
SPQ 25
ECCN --
Schedule B --
RoHS --
Datasheet --

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Product parameter

-Melting Point 361°F (183°C)
-Core Size 2.2%
-Diameter 0.031" (0.79mm)
-Process Leaded
-Wire Gauge 20 AWG, 21 SWG
-Composition Sn63Pb37 (63/37)
-Type Wire Solder
-Standard Package   25
-MSDS Material Safety Datasheet One Step - No Clean MSDS
-Family Solder
-Flux Type No-Clean

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