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386839

63/37 370 3% .032DIA/21SWG

Manufacturer Henkel
MPN 386839
SPQ 20
ECCN --
Schedule B --
RoHS --
Datasheet --

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Product parameter

-Melting Point 361°F (183°C)
-Core Size 0.03
-Part Status Active
-Manufacturer Multicore
-Process Leaded
-Family Solder
-Flux Type Rosin Activated (RA)
-Type Wire Solder
-Diameter 0.032" (0.81mm)
-Category Soldering, Desoldering, Rework Products
-Form Spool, 454g (1 lb)
-Series 370
-Wire Gauge 20 AWG, 21 AWG
-Composition Sn63Pb37 (63/37)

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