| -Propagation Delay (Max) |
8碌s |
| -PCN Assembly/Origin |
SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 |
| -Supplier Device Package |
8-SOIC N |
| -Hysteresis |
6.5mV |
| -Standard Package |
3,300 |
| -PCN Design/Specification |
SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 Multiple Devices Datasheet Update 18/Aug/2014 |
| -Output Type |
CMOS, Push-Pull, Rail-to-Rail, TTL |
| -Mounting Type |
Surface Mount |
| -Operating Temperature |
-40掳C ~ 125掳C |
| -Number of Elements |
2 |
| -Package / Case |
T/R |
| -Type |
General Purpose |
| -Voltage - Supply, Single/Dual (卤) |
1.6 V ~ 5.5 V |
| -Voltage - Input Offset (Max) |
7mV @ 5.5V |
| -Current - Input Bias (Max) |
1pA @ 5.5V |
| -Packaging |
Tape & Reel (TR) |
| -Family |
Linear - Comparators |
| -CMRR, PSRR (Typ) |
70dB CMRR, 80dB PSRR |
| -Current - Quiescent (Max) |
1碌A |
| -SDP |
8-SOIC 3.90mm(.150in) |
