| -PCN Assembly/Origin |
SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 |
| -PCN Packaging |
Reel Design Update 07/May/2015 |
| -Current - Input Bias |
1pA |
| -Amplifier Type |
General Purpose |
| -Gain Bandwidth Product |
2.8MHz |
| -Voltage - Input Offset |
700µV |
| -Supplier Device Package |
8-SOIC N |
| -PCN Design/Specification |
SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 Multiple Devices Datasheet Update 18/Aug/2014 |
| -Output Type |
Rail-to-Rail |
| -Operating Temperature |
-40°C ~ 125°C |
| -ECCN |
EAR99 |
| -Voltage - Supply, Single/Dual (±) |
2.7 V ~ 6 V |
| -Number of Circuits |
2 |
| -Mounting Type |
Surface Mount |
| -Current - Supply |
230µA |
| -Package / Case |
T/R |
| -Current - Output / Channel |
22mA |
| -Standard Package |
3,300 |
| -Packaging |
Tape & Reel (TR) |
| -Family |
Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
| -Slew Rate |
2.3 V/µs |
| -SDP |
8-SOIC 3.90mm(.150in) |
