| -PCN Assembly/Origin |
SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 |
| -Architecture |
SAR |
| -Ratio - S/H:ADC |
1:1 |
| -Number of A/D Converters |
1 |
| -Data Interface |
SPI |
| -For Use With |
TMPSNS-RTD1-ND - BOARD EVAL PT100 RTD TEMP SENSOR |
| -Reference Type |
External |
| -Standard Package |
3,300 |
| -Packaging |
Tape & Reel (TR) |
| -Family |
Data Acquisition - Analog to Digital Converters (ADC) |
| -Operating Temperature |
-40°C ~ 85°C |
| -Voltage - Supply, Analog |
4.5 V ~ 5.5 V |
| -Sampling Rate (Per Second) |
100k |
| -Voltage - Supply, Digital |
4.5 V ~ 5.5 V |
| -Input Type |
Differential, Pseudo-Differential |
| -Package / Case |
T/R |
| -Supplier Device Package |
8-SOIC N |
| -Configuration |
S/H-ADC |
| -PCN Design/Specification |
SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 |
| -Number of Inputs |
1 |
| -Number of Bits |
13 |
| -SDP |
8-SOIC 3.90mm(.150in) |
