HF115AC-0.0055-AC-105

THERM PAD SIP PKG W/ADH HI-FLOW

Manufacturer Bergquist MPN HF115AC-0.0055-AC-105 SPQ 6000 ECCN -- Schedule B -- RoHS -- Datasheet --

Quote

Demand quantity		Target price
Contact number		name
company		email

Product parameter

-Backing, Carrier	Fiberglass
-Catalog Drawings	SIP_105
-Standard Package	100
-Color	Gray
-Adhesive	Adhesive - One Side
-Thermal Resistivity	0.35°C/W
-Family	Thermal - Pads, Sheets
-RoHS Information	Hi-Flow 115-AC Material Report
-Material	Phase Change Compound
-Thickness	0.0055" (0.140mm)
-Usage	SIP
-Shape	Rectangle
-Other Related Documents	Sil-Pad Metric Configurations
-Series	Hi-Flow® 115-AC
-Outline	36.83mm x 21.29mm
-Thermal Conductivity	0.8 W/m-K