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DIP316-011BLF

CONN IC DIP SOCKET 16POS GOLD

Manufacturer Amphenol
MPN DIP316-011BLF
SPQ 2700
ECCN --
Schedule B --
RoHS --
Datasheet --

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Product parameter

-Pitch - Post 0.100" (2.54mm)
-Type DIP, 0.3" (7.62mm) Row Spacing
-Contact Finish Thickness - Post 200µin (5.08µm)
-Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-Contact Material - Mating Beryllium Copper
-Mounting Type Through Hole
-Termination Solder
-Contact Finish - Post Tin
-Packaging   Tube  
-Contact Finish Thickness - Mating 10µin (0.25µm)
-Termination Post Length 0.125" (3.18mm)
-PCN Obsolescence/ EOL Multiple Devices/Sockets 04/Dec/2008
-Number of Positions or Pins (Grid) 16 (2 x 8)
-Contact Material - Post Brass
-Pitch - Mating 0.100" (2.54mm)
-Material Flammability Rating UL94 V-0
-Standard Package   2,700
-Features Open Frame
-Contact Finish - Mating Gold
-Family Sockets for ICs, Transistors

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