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DIP050-628-157BLF

CONN IC DIP SOCKET 28POS TIN

Manufacturer Amphenol
MPN DIP050-628-157BLF
SPQ 882
ECCN --
Schedule B --
RoHS --
Datasheet --

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Product parameter

-Pitch - Post 0.100" (2.54mm)
-Type DIP, 0.6" (15.24mm) Row Spacing
-Contact Finish Thickness - Post 200µin (5.08µm)
-Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-Contact Material - Mating Beryllium Copper
-Mounting Type Through Hole
-Termination Solder
-Contact Finish - Post Tin
-Packaging   Tube  
-Contact Finish Thickness - Mating 100µin (2.54µm)
-Termination Post Length 0.095" (2.41mm)
-PCN Obsolescence/ EOL Multiple Devices/Sockets 04/Dec/2008
-Number of Positions or Pins (Grid) 28 (2 x 14)
-Contact Material - Post Brass
-Pitch - Mating 0.100" (2.54mm)
-Material Flammability Rating UL94 V-0
-Standard Package   882
-Features Open Frame
-Contact Finish - Mating Tin
-Family Sockets for ICs, Transistors

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