| -FET Feature |
Standard |
| -PCN Assembly/Origin |
AUIRFxx Series Wafer Process 29/Jul/2013 |
| -Power - Max |
300W |
| -Supplier Device Package |
D2PAK (7-Lead) |
| -Standard Package |
800 |
| -Packaging |
Tape & Reel (TR) |
| -Series |
HEXFET® |
| -Vgs(th) (Max) @ Id |
4V @ 250µA |
| -Input Capacitance (Ciss) @ Vds |
7820pF @ 25V |
| -Rds On (Max) @ Id, Vgs |
2.6 mOhm @ 140A, 10V |
| -Package / Case |
TO-263-7, D²Pak (6 Leads + Tab), TO-263CB |
| -Drain to Source Voltage (Vdss) |
55V |
| -Current - Continuous Drain (Id) @ 25°C |
160A (Tc) |
| -Gate Charge (Qg) @ Vgs |
200nC @ 10V |
| -FET Type |
MOSFET N-Channel, Metal Oxide |
| -Family |
FETs - Single |
| -Mounting Type |
Surface Mount |
