APF19-19-13CB

HEATSINK LOW-PROFILE FORGED

Manufacturer CTS Electronic Components MPN APF19-19-13CB SPQ 300 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
-Type	Top Mount
-Catalog Drawings	APF-19-19-13CB Series
-Shape	Square, Fins
-Length	0.748" (19.00mm)
-Thermal Resistance @ Forced Air Flow	4.0°C/W @ 200 LFM
-Height Off Base (Height of Fin)	0.500" (12.70mm)
-RoHS Information	APF Series RoHS Cert
-Attachment Method	Thermal Tape, Adhesive (Not Included)
-Material	Aluminum
-Standard Package	300
-Material Finish	Black Anodized
-Series	APF
-Family	Thermal - Heat Sinks
-Width	0.748" (19.00mm)