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| 需求数量 | 目标价格 | ||
| 联系电话 | 姓名 | ||
| 公司 | 邮箱 | ||
| -Primary Attributes | ProASIC庐3 FPGA, 60K Gates, 1536 D-Flip-Flops |
| -Package / Case | 144-LQFP |
| -Supplier Device Package | 144-TQFP (20x20) |
| -Architecture | MCU, FPGA |
| -Standard Package | 60 |
| -Packaging | Tray |
| -Series | SmartFusion庐 |
| -PCN Other | SmartFusion Fixes 11/Mar/2015 |
| -Operating Temperature | -40掳C ~ 100掳C |
| -MCU RAM | 16KB |
| -Core Processor | ARM庐 Cortex庐-M3 |
| -Peripherals | DMA, POR, WDT |
| -Number of I/O | MCU - 21, FPGA - 33 |
| -Connectivity | EBI/EMI, I虏C, SPI, UART/USART |
| -Speed | 100MHz |
| -Family | Embedded - System On Chip (SoC) |
| -MCU Flash | 128KB |
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