| -Video File |
PowerStack™ Packaging Technology Overview |
| -Product Training Modules |
NexFET MOSFET Technology |
| -Manufacturer Product Page |
CSD86330Q3D Specifications |
| -Featured Product |
CSD86330Q3D NexFET™ Power Block CSD86330Q3D Power Block and TPS53219 Buck Controller |
| -PCN Design/Specification |
Qualification Revision A 01/Jul/2014 |
| -Datasheets |
CSD86330Q3D |
| -PCN Assembly/Origin |
Qualification Assembly/Test Site 03/Mar/2014 Qualification Revision 10/Mar/2014 Qualification Wire Bond 27/May/2014 Assembly/Test Site Transfer 19/Dec/2014 Assembly/Test Site Revision C 09/Feb/2015 |
| -Online Catalog |
N-Channel Logic Level Gate FETs |
| -PCN Packaging |
MSL1 Bubble Bag Conversion 24/Sep/2013 |
| -ECCN |
EAR99 |