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804069

Manufacturer Bergquist
MPN 804069
SPQ 60
ECCN --
Schedule B --
RoHS --
Datasheet 804069.pdf

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Product parameter

-Series: Thermal Clad
-Core Material: Aluminum
-Tradename: Thermal Clad
-Designed for: Samsung Sunnix
-Thermal Conductivity: 1.3 W/m-K
-Configuration: Star Array
-Factory Pack Quantity: 10
-Brand: Bergquist Company
-RoHS:  Details
-Product Category: Thermal Substrates - MCPCB
-Manufacturer: Bergquist Company

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