658-60ABT1

HEATSINK CPU 28MM SQ BLK W/TAPE

Manufacturer Wakefield Engineering/Alpha Technologies Group MPN 658-60ABT1 SPQ 1 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Package Cooled	BGA
-Type	Top Mount
-Catalog Drawings	658-60AB Series
-Shape	Square, Pin Fins
-Material Finish	Black Anodized
-Series	658
-Family	Thermal - Heat Sinks
-Width	1.100" (27.94mm)
-Attachment Method	Thermal Tape, Adhesive (Included)
-Material	Aluminum
-Standard Package	1
-Power Dissipation @ Temperature Rise	2.5W @ 30°C
-Length	1.100" (27.94mm)
-Thermal Resistance @ Forced Air Flow	2.0°C/W @ 500 LFM
-Height Off Base (Height of Fin)	0.598" (15.20mm)