625-25ABT4

HEATSINK CPU 25MM SQ W/DBL TAPE

Manufacturer Wakefield Engineering/Alpha Technologies Group MPN 625-25ABT4 SPQ 1 ECCN -- Schedule B -- RoHS -- Datasheet --

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Product parameter

-Package Cooled	BGA
-Type	Top Mount
-Catalog Drawings	625-25AB Series
-Shape	Square, Pin Fins
-Length	0.984" (25.00mm)
-Thermal Resistance @ Forced Air Flow	12掳C/W @ 500 LFM
-Height Off Base (Height of Fin)	0.250" (6.35mm)
-Attachment Method	Thermal Tape, Adhesive (Included)
-Material	Aluminum
-Standard Package	1
-Material Finish	Black Anodized
-Series	625
-Family	Thermal - Heat Sinks
-Width	0.984" (25.00mm)