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2292BG

2292BG - Leadless Chip Carriers & Flat Packs Bond On Heat Sink

制造商 Aavid Thermalloy
制造商零件编号 2292BG
标准包装 500
ECCN EAR99
Schedule B --
RoHS --
规格说明书 --

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产品参数

-Package Cooled BGA
-Type Board Level
-Standard Package   500
-Diameter 0.300" (7.62mm) ID, 1.125" (28.57mm) OD
-Power Dissipation @ Temperature Rise 1.5W @ 40°C
-Thermal Resistance @ Forced Air Flow 8.0°C/W @ 400 LFM
-ECCN EAR99
-Attachment Method Thermal Tape, Adhesive (Not Included)
-Material Aluminum
-Product Training Modules How to Select a Heat Sink
-Shape Cylindrical
-Material Finish Black Anodized
-Family Thermal - Heat Sinks

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