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| 需求数量 | 目标价格 | ||
| 联系电话 | 姓名 | ||
| 公司 | 邮箱 | ||
| -Package Cooled | BGA |
| -Type | Board Level |
| -Standard Package | 500 |
| -Diameter | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
| -Power Dissipation @ Temperature Rise | 1.5W @ 40°C |
| -Thermal Resistance @ Forced Air Flow | 8.0°C/W @ 400 LFM |
| -ECCN | EAR99 |
| -Attachment Method | Thermal Tape, Adhesive (Not Included) |
| -Material | Aluminum |
| -Product Training Modules | How to Select a Heat Sink |
| -Shape | Cylindrical |
| -Material Finish | Black Anodized |
| -Family | Thermal - Heat Sinks |
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