2292BG

2292BG - Leadless Chip Carriers & Flat Packs Bond On Heat Sink

Manufacturer Aavid Thermalloy MPN 2292BG SPQ 500 ECCN EAR99 Schedule B -- RoHS -- Datasheet --

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Product parameter

-Package Cooled	BGA
-Type	Board Level
-Standard Package	500
-Diameter	0.300" (7.62mm) ID, 1.125" (28.57mm) OD
-Power Dissipation @ Temperature Rise	1.5W @ 40°C
-Thermal Resistance @ Forced Air Flow	8.0°C/W @ 400 LFM
-ECCN	EAR99
-Attachment Method	Thermal Tape, Adhesive (Not Included)
-Material	Aluminum
-Product Training Modules	How to Select a Heat Sink
-Shape	Cylindrical
-Material Finish	Black Anodized
-Family	Thermal - Heat Sinks