| -Termination |
Solder |
| -Type |
PGA, ZIF (ZIP) |
| -Features |
Open Frame |
| -Number of Positions or Pins (Grid) |
988 (35 x 36) |
| -Contact Finish - Mating |
Gold |
| -Contact Finish Thickness - Mating |
15碌in (0.38碌m) |
| -Pitch - Mating |
0.039" (1.00mm) |
| -Mounting Type |
Surface Mount |
| -3D Model |
1-2013620-3.pdf |
| -Pitch - Post |
0.039" (1.00mm) |
| -Standard Package |
360 |
| -Packaging |
Tape & Reel (TR) |
| -Housing Material |
Thermoplastic |
| -Contact Material - Post |
Copper Alloy |
| -Contact Material - Mating |
Copper Alloy |
| -Family |
Sockets for ICs, Transistors |
| -RoHS Information |
1-2013620-3 Statement of Compliance RoHS 2 Statement |
| -Material Flammability Rating |
UL94 V-0 |
