| -Pitch - Post |
0.100" (2.54mm) |
| -Type |
DIP, 0.6" (15.24mm) Row Spacing |
| -Contact Finish Thickness - Post |
30µin (0.76µm) |
| -Housing Material |
Thermoplastic, Glass Filled |
| -Contact Material - Mating |
Beryllium Copper |
| -Mounting Type |
Through Hole |
| -Termination |
Solder |
| -Contact Finish - Post |
Gold |
| -Packaging |
Tube |
| -Contact Finish Thickness - Mating |
30µin (0.76µm) |
| -Family |
Sockets for ICs, Transistors |
| -RoHS Information |
1-1825108-3 Statement of Compliance RoHS 2 Statement |
| -Termination Post Length |
0.128" (3.24mm) |
| -PCN Obsolescence/ EOL |
Socket product 01/Jul/2014 |
| -Number of Positions or Pins (Grid) |
40 (2 x 20) |
| -Contact Material - Post |
Beryllium Copper |
| -Pitch - Mating |
0.100" (2.54mm) |
| -Material Flammability Rating |
UL94 V-0 |
| -Standard Package |
10 |
| -Features |
Closed Frame |
| -Contact Finish - Mating |
Gold |
| -Series |
Diplomate DL, AMP |
| -Contact Resistance |
30 mOhm |
| -Operating Temperature |
-55°C ~ 125°C |
