| -Termination |
Solder |
| -Type |
LGA |
| -Features |
Open Frame |
| -Number of Positions or Pins (Grid) |
771 (33 x 33) |
| -Contact Finish - Mating |
Gold |
| -Contact Material - Mating |
Copper Alloy |
| -Pitch - Mating |
0.043" (1.09mm) |
| -Mounting Type |
Surface Mount |
| -Operating Temperature |
-25°C ~ 100°C |
| -Material Flammability Rating |
UL94 V-0 |
| -Pitch - Post |
0.043" (1.09mm) |
| -Standard Package |
2,000 |
| -Packaging |
Tray |
| -Housing Material |
Thermoplastic |
| -Contact Finish Thickness - Mating |
30µin (0.76µm) |
| -Series |
AMP |
| -Family |
Sockets for ICs, Transistors |
| -RoHS Information |
1-1747890-2 Statement of Compliance RoHS 2 Statement |
| -3D Model |
1-1747890-2.pdf |
| -Current Rating |
0.8A |
