| -Pitch - Post |
0.050" (1.27mm) |
| -Contact Finish Thickness - Post |
30µin (0.76µm) |
| -Housing Material |
Thermoplastic |
| -Contact Material - Mating |
Copper Alloy |
| -Mounting Type |
Surface Mount |
| -Termination |
Solder |
| -Standard Package |
1 |
| -Features |
Open Frame |
| -Contact Finish - Mating |
Gold |
| -Family |
Sockets for ICs, Transistors |
| -3D Model |
1-1674770-2.pdf |
| -Type |
PGA, ZIF (ZIP) |
| -Number of Positions or Pins (Grid) |
478 (26 x 26) |
| -Contact Material - Post |
Copper Alloy |
| -Pitch - Mating |
0.050" (1.27mm) |
| -Material Flammability Rating |
UL94 V-0 |
| -Catalog Drawings |
1674770-2,6 |
| -Contact Finish - Post |
Gold |
| -Packaging |
Cut Tape (CT) |
| -Contact Finish Thickness - Mating |
30µin (0.76µm) |
| -RoHS Information |
1-1674770-2 Statement of Compliance RoHS 2 Statement |
