NXP血糖监测仪优化方案

Release time:2017-05-03
author:
source:网络
reading:286

 1、前言

NXP血糖监测仪(CGM)用于实时测量1型和2型糖尿病患者血液中的葡萄糖含量。监测使患者能够更频繁地调整用药剂量,通过移动设备接收通知,无线连接到医疗云服务,并更准确地调整胰岛素用量。它为用户提供了一种简单易用的方法,能够实时、无痛地采集血糖读数。

2、方案概述

NXP血糖监测仪解决方案主要使用Kinetis®系列的ARM® Cortex™得MCU,提供高度集成、低功耗、互联的解决方案。


元器件选型

类别

产品

特性

Microcontroller  (MCU)

Kinetis® K2x USB Microcontrollers (MCUs) based on ARM®  Cortex®-M4 Core

Low-power,  ARM Cortex-M4, high-speed USB 2.0

Kinetis® KL2x-48 MHz, USB Ultra-Low-Power Microcontrollers  (MCUs) based on ARM® Cortex®-M0+ Core

Ultra-low-power,  Low-cost, ARM® Cortex-M0+, full-speed USB 2.0

Kinetis® K5x Measurement Microcontrollers (MCUs) based on  ARM® Cortex®-M4 Core

Low-power,  low-cost, Kinetis series Integrated Opamps, Triamps

Kinetis® K1x Mainstream Microcontrollers (MCUs) based on  ARM® Cortex®-M4 Core

Low-power,  ARM Cortex-M4

Kinetis® KL1x-48 MHz, Mainstream Small Ultra-Low Power  Microcontrollers (MCUs) based on ARM® Cortex®-M0+ Core

Ultra-low-power,  low-cost, ARM Cortex-M0+

Microprocessor  (MPU)

i.MX 6SoloLite  Processors – Single-Core, Low-Power, EPD Controller, ARM Cortex-A9 Core

Applications  Processor, 1GHz

i.MX  6UltraLite Processor - Low-power, secure, ARM® Cortex®-A7 Core

Cortex-A7  up to 696 MHz, integrated power management module, multiple memory and  peripheral interfaces

i.MX 7Solo  Processors - Heterogeneous Processing with ARM® Cortex®-A7 and Cortex-M4  cores

Cortex-A7  up to 1 GHz and Cortex-M4, high performance processing for low power  requirements with a high degree of functional integration

Power Management

3.0A 1.0MHz  Integrated DDR Switch-Mode Power Supply

Zigbee  2.4 GHz, Low-power

Touch  Screen

NXP Touch  Software

Software  download features touch detection algorithms and is ideally suited for RTOS  based applications

Wireless  Comm.

Ultra low  power Bluetooth LE system-on-chip solution

ARM  Cortex M0, BLE v4.0

NTAG I²C -  Energy harvesting NFC Forum Type 2 Tag with field detection pin and I²C  interface

Near  Field Communication (NFC), I2C Contact Interface

Kinetis  KW30Z-2.4 GHz Bluetooth Low Energy (BLE 4.1) Microcontroller based on ARM® Cortex®-M0+

Low  Power ARM Cortex M0+, BLE v4.1, ZigBee

Kinetis® KW31Z-2.4 GHz Bluetooth Low Energy (BLE) Wireless  Radio Microcontroller (MCU) based on ARM® Cortex®-M0+ Core

Low  Power ARM Cortex M0+, BLE v4.2, ZigBee, Thread, Dual PAN


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reading
NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:913
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