NXP混合3D显示仪表板解决方案

Release time:2017-05-03
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source:网络
reading:338

1、  前言

NXP混合3D显示仪表板解决方案提供一个全面的产品组合,以满足混合仪表盘需求,在高分辨率显示器上支持模拟仪表和3D图形。三维效果是通过两台车内摄像机实时测量驾驶者眼睛位置以及与眼睛间的距离实现的。

2、  方案概述


NXP混合3D显示仪表板解决方案从车辆连接和系统MCU到带可扩展的3D图形性能的汽车应用处理器。该方案使用的汽车应用处理器提供如OpenGL ES 2.0Open GL ES3.0等常用3D图形API,打造丰富的用户体验,是汽车仪表板应用中实现逼真视觉呈现的理想解决方案。这些处理器还有一个广泛的开发工具生态合作体系作支持,优化的解决方案,满足OEM的要求。


 

元器件选型:

类别

产品

特性

Automotive  Applications Processors






i.MX 6DualLite  Processors – Dual-Core, 3D Graphics, HD Video, ARM Cortex-A9 Core

i.MX 6Dual  Processors - Dual-Core, 3D Graphics, HD Video, Multimedia, ARM Cortex-A9 Core

ARM®  Cortex™-A9 dual-core CPU, video and Triple-Play graphics acceleration

i.MX 6Solo  Processors – Single-Core, Multimedia, 3D Graphics, ARM Cortex-A9 Core


ARM®  Cortex™-A9 single-core CPU, video and Triple-Play graphics acceleration

Signal Conditioning 


MSDI with  Suppressed Wakeup

Multiple  switch detection interface

Discretes


Discretes and  Logic

Automotive  MOSFETs, Bipolar Transistors, Diodes, High Side Switches, Low Side Switches,  Logic, Squib Drivers and Transient Voltage Suppressors

I/O  Protection

Automotive  MOSFETs

AEC-Q101  compliant, repetitive avalanche rated, suitable for thermally demanding  environments due to 175°C rating

ESD Protection

Designed  to protect FlexRay bus, CAN and LIN transceivers as well as other ESD  sensitive automotive electronic components


车载网络


CAN  Transceivers

一个全面的产品组合,包括适合所有CAN物理层特性的汽车级收发器

LIN  Transceivers

基于汽车应用中低成本通信行业标准的广泛LIN解决方案

CAN/LIN System  Basis Chips

系统基础芯片,包括我们的UJA107xAUJA106x TJA1028, 为当今的汽车控制单元提供紧凑、可扩展的解决方案

Power  Supply

Power  Management for i.MX Application Processors

PMICs  are designed for use with the various families of i.MX applications  processors and integrate both switching and linear regulators required for  the total system solution

Automotive  MOSFETs

AEC-Q101  compliant, repetitive avalanche rated, suitable for thermally demanding  environments due to 175°C rating

CAN/LIN System  Basis Chips

System  basis chips, including our UJA107xA, UJA106x and TJA1028, offer a compact and  scalable solution for today's automotive control units

胶合逻辑



Automotive  Flip-Flops

符合AEC-Q100的要求,适用于汽车应用

Automotive  Analog Switches

一系列模拟开关和多路复用器/多路分离器电路符合AEC-Q100的要求

Sensors

Sensors

Sensor  designed with the right combination of intelligent integration, logic and  customizable software

Software  Services and Support

Professional  Support and Service Resources

Different  levels of professional services and support based on your individual needs.



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reading
NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:914
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