NXP无线充电解决方案

Release time：2017-04-15
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source：Ameya360
reading：2761

1.前言

人们对移动设备的电源要求越来越高，因此需要全新的管理电池使用时间的方式。无线充电就是其中一种方式，它为广泛的设备创建了一个通用的充电平台，并提供了一个基础设施对其进行支持。飞思卡尔的无线充电解决方案提供了智能的、基于软件的无线传输电能的方式。该产品组合提供了带有高度可定制特性的硬件和软件，以实现最大灵活性。


2.方案概述

人们对移动设备的电源要求越来越高，因此需要全新的管理电池使用时间的方式。无线充电就是其中一种方式，它为广泛的设备创建了一个通用的充电平台，并提供了一个基础设施对其进行支持。飞思卡尔的无线充电解决方案提供了智能的、基于软件的无线传输电能的方式。该产品组合提供了带有高度可定制特性的硬件和软件，以实现最大灵活性。



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Extensive stock of NXP,Don't miss it!

About NXPNXP Semiconductors - NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. HOT MODELS    If interested kindly click here for more details:http://ameya360.com/stockpromot/nxp/1
2018-07-16 00:00 reading：943
Trade news

NXP Sells Stake in China Foundry ASMC

NXP Semiconductors NV said Wednesday (April 19) it sold its 27 percent remaining stake in Advanced Semiconductor Manufacturing Corp. Ltd. (ASMC), a chip foundry based in China. ASMC began as a joint venture in the late 1980s between the Chinese Government and Royal Philips Electronics NV , the Dutch giant that eventually spun off NXP. ASMC, originally known as Philips Semiconductor Shanghai, exclusively made chips for Philips for years. It has two 8-inch wafer fabs in Shanghai. NXP (Eindhovern, the Netherlands) said it sold its 421.45 million shares, representing 27.47 percent ownership of ASMIC, for $53.7 million to Shanghai Pudong Science and Technology Investment Co. Ltd. NXP is in the process of being acquired by U.S. chip giant Qualcomm Inc., a fabless company that relies solely on foundries for manufacturing of its chips. The divestiture of NXP's stake in ASMC may have been a step toward closing the deal or achieving regulatory compliance in China. Qualcomm said recently that the deal's waiting period under the Hart-Scott-Rodino act had expired without any antitrust objections being raised by the U.S. Federal Trade Commission. The Qualcomm-NXP deal is expected to close by the end of this year. —Dylan McGrath is the editor-in-chief of EE Times. Related content: Qualcomm-NXP Deal Targets Connected World Qualcomm-NXP: Another Testosterone-Driven Deal? Q'comm-NXP Faces Trump, China Hurdles
2017-04-19 00:00 reading：394
Trade news

NXP Shows First FD-SOI Chips

NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading：915
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