NXP UAV中级飞行控制器

Release time:2017-04-15
author:
source:Ameya360
reading:100352

1、前言

   所谓无人机的飞行控制器,就是无人机的飞行控制系统,主要有陀螺仪(飞行姿态感知),加速计,地磁感应飞控飞控 ,气压传感器(悬停控制),GPS模块(选装),以及控制电路组成。主要的功能就是自动保持飞机的正常飞行姿态。

2、方案概述

   中级UAV飞行控制器适用于高端个人UAV以及需要加入更高级通信总线的研究和商业系统。使用带集成式Flexio的恩智浦MCU,可将自定义接口(如检测故障或障碍物的单个电机转速表)置于一块芯片上 系统显示此处还包括NFC。这种独特接口可以用于授权飞行员在特定区域/机场飞行或对飞行特性设置作出快速调整等. 同时,RFID技术被越来越多地用于盘点室内库存项目。这可以扩展到包括户外资产,如牲畜、电力线变压器。

料号清单


类别 产品 特性
MCU (Kinetis K系列)

Kinetis® K Series: High Performance Microcontrollers (MCUs) based on ARM® Cortex®-M4 Core
Kinetis KV5x-240 MHz, Motor Control and Power Conversion, Ethernet, MCUs based on ARM® Cortex®-M7
LPC Microcontrollers
Kinetis® K64-120 MHz, 256KB SRAM Microcontrollers (MCUs) based on ARM® Cortex®-M4 Core 适用于飞行控制器的典型MCU。不过,新型设计可以考虑M7内核。
传感器

Vacuum Sensors –50 to –115 kPa
Barometric Pressure 15 to 115 kPa
Accelerometers
Gyroscopes
Magnetometers
Pressure Sensors
Bluetooth® Smart/Bluetooth Low Energy Solutions
通信总线

NFC and Reader ICs
Highly integrated RFID reader module PRH601
I2C Bus Repeaters/Hubs/Extenders
CAN Physical Interfaces
CAN/LIN/FlexRay Transceivers
SBC Gen2 with High-Speed CAN and LIN
CAN Transceivers
Enhanced fault-tolerant CAN transceiver
Self-supplied high-speed CAN transceiver with Sleep mode
High-speed CAN core system basis chip
OABR Compliant Automotive Ethernet PHY Transceiver



Online messageinquiry

reading
NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:1039
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TPIC6C595DR Texas Instruments
TL431ACLPR Texas Instruments
TPS61021ADSGR Texas Instruments
CD74HC4051QPWRQ1 Texas Instruments
TPS5430DDAR Texas Instruments
TXB0108PWR Texas Instruments
model brand To snap up
ULQ2003AQDRQ1 Texas Instruments
TXS0104EPWR Texas Instruments
TPS61256YFFR Texas Instruments
TPS63050YFFR Texas Instruments
TPS5430DDAR Texas Instruments
TPS61021ADSGR Texas Instruments
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Information leaderboard
  • Week of ranking
  • Month ranking
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.