优势库存握在手,该出手时就出手

Release time:2017-04-07
author:Ameya360
source:今日头条
reading:1098

起床的方式有千万种

套路A:7:00

套路B:6:50、6:55、7:00、7:05

呵呵,幼稚

A妹我:“喂,早上好,您是哪。。”“我说你怎么还敢睡觉啊,那颗料到底能不能供,你就说能不能!研发,车间都就绪了,就等你这颗料了,今天再不给消息,别怪我cancel!哼!”,啪!

终端大大很生气,我也很无奈啊,ic行业就这样,有货都是兄弟,没货立即翻脸。

今天A妹给大家准备了一批优势料号,茫茫芯海中,看看是不是你正在苦苦寻找的?

优势库存

01-Altera

5M80ZE64I5N

16+DC

16K stock now

02-TI

稀缺料中的战斗芯

TPS53515RVER

DC: 16+

51K stock

03-NXP

以下均为美金价格,不含税

NTS0101GW

自营库存:54000pcs

PESD5V0S1BL,315

170000pcs

MCF5474VR266

100pcs

04-Linear

LTC6803IG-4#3ZZTRPBF

stock : 8K

DC:16+

不拆包

05-ROHM

AMEYA360自营库存

罗姆sic系列

BSM300D12P2E001

8pcs

06-broadcom

PEX8732-CA80BC G

840pcs

BCM5221A4KPTG

2k

07-vishay

SI2343CDS-T1-GE3

57k

交不上货就非要这么相爱相杀拳脚相加吗?就不能冷静坐下来互相砍对方几刀吗?买不到的料这么着急,你上AMEYA360问了嘛?

从今天开始关注AMEYA360电子元器件供应平台,A妹会定时给大家推送冷门、稀缺、热销、特价型号库存信息,万一就拯救到您了呢!

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reading
NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:923
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