| 1542706-2 | ||
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| 产品描述：
HEAT SINK XFP NETWORK APPS
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| 标准包装：100 | ||
| 数据手册： -- | ||
| ECAD模型:
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- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Online Catalog | ChipCoolers Series |
|---|---|
| Product Training Modules | High Speed Pluggable I/O Solutions |
| 3D Model | 1542706-2.pdf |
| Datasheets | 1542706 |
| Featured Product | High Speed Pluggable I-O Solutions |
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