台积电和GF在7nm制程大翻身,“挤牙膏”的英特尔毫无意外掉队

Release time：2017-06-26
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source：IT之家
reading：188

科技网站Anandtech公布了几家半导体巨头最新的制程路线图，主要就是下一代的10nm和7nm工艺制程。通过路线图可以看到台积电与GF可以说即将翻身，而老牌企业Intel则将在10nm制程徘徊一段时间。

从官方公布的路线图来看，台积电是最快到达7nm工艺制程的厂商，在2018年第一季度就可以搞定7nm ff工艺，而GF则在2018年第二季度更新至7nm工艺。三星将会在2019年更新至7nm工艺，至于Intel将会在今后几年不断地改良自己的10nm工艺，就算出来了也要到2021年之后了。










不过GF为7nm划分了三代，第一代是DUV（深紫外光刻），而导入EUV（极紫外光刻）需要到2019年。技术指标上，GF的第一代/第二代7nm相较14nm FinFET可提升40%性能、降低60%功耗，芯片成本降低30%。

如果各家制程路线图没有什么区别的话，那么未来等到Intel使用7nm的时候，迎来的将会是使用7nm改良版的AMD Zen2/3处理器。

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